Title: Silicon Sands: Shifts in Semiconductor Market Drivers
Speaker: Gregory K. Hinckley, President of Mentor Graphics Corporation
The silicon semiconductor industry is still absorbing an unprecedented $120B in reported M&A activity in 2015. This in large part reflects the maturing of the consumer electronics market, especially in devices for mobile phones. Greg Hinckley, President of Mentor Graphics, will discuss how emerging trends are starting to dramatically alter the landscape of our industry creating exciting opportunities for growth. These shifts include the dramatic upsurge in automotive electronics, the deepening pervasiveness of smart embedded devices and the promising new era of the Internet of Things (IoT). But these changes require that silicon designers and manufacturers adopt new mindsets and strategies to capitalize on these semiconductor market drivers.
Gregory K. Hinckley serves as President of Mentor Graphics Corporation, a publicly traded provider of electronic design automation solutions. Prior to Mentor Graphics, he served as a senior executive for two other publicly traded companies—VLSI Technology, Inc. and Bio-Rad Laboratories, Inc. Mr. Hinckley is a director of SI-Bone, Inc. (a privately held orthopedic device company), a director of Super Micro (a publicly traded provider of advanced computer server systems and subsystems), an advisory director of Portland State University Engineering School and a member of the Board of Trustees for Claremont McKenna College.
Mr. Hinckley holds a Bachelor of Arts degree in physics from Claremont McKenna College, a Master of Science degree in applied physics from University of California, San Diego, an MBA degree from Harvard Business School, and was a Fulbright Scholar in applied mathematics at the Nottingham University in England. He is also a Certified Public Accountant.
Title: Technology sourcing in the age of IoT – an NXP perspective
Speaker: Dr. Komin Chang, Senior Director of Global Technology Innovation, NXP, Austin, TX, USA
The internet of things (IoT) holds tremendous promise for the expansion of the semiconductor business. A generalized view of an IoT device is that anything which has the smarts to connect wirelessly, to exchange information securely, and to act upon such information efficiently. In NXP we call these secure connected devices. We strive to provide solutions to enable secure connections for the smarter world. The recent merger with Freescale afforded the new NXP with excellent market positions in automotive, secure identification, mobile transaction, and embedded processing. In this presentation, we focus on how the businesses are enabled to develop solutions with differentiating features that will enhance user experiences. We will introduce a number of technology platforms on which innovative circuits and systems are being realized that are most suitable for IoT. Modular construction of these platforms allow otherwise heterogeneous device components be integrated in an orthogonal way such that a rich set of functionalities can be cost effectively provisioned. Functionalities such as RF for connectivity, non-volatile memory, low power, high performance for processing and control, and high voltage for actuation are all enabled. In addition, sourcing of these technologies in sync with the capacity demand requires careful planning for smooth ramp up of wafer volume. Seamless porting of circuit IP’s is essential to achieving such objectives.
Dr. Ko-Min Chang is a Senior Director, Global Technology Innovation at NXP Semiconductors. He works with the businesses and the technology community to align technology roadmaps in microcontrollers, apps processors, secure elements/NFC, wearables, hearables, smart homes, and industrial IoT. He also worked on high voltage and power technology as well as disruptive non-volatile memory solutions.
Dr. Chang joined NXP in Eindhoven, the Netherlands, since early 2014. Prior to that, he spent 25+ years in Austin, Texas, with Motorola/Freescale, managing IP development for microcontrollers and flash technology development. Dr. Chang received the EE Ph.D. from the Ohio State University in Columbus, Ohio, and holds 30+ US patents.
Title: Enabling Integrated Circuits of the Future
Speakers: E.A. Fitzgerald, of Massachusetts Institute of Technology, and J. Chang, of Nanyang Technological University.
In the roadmap of semiconductor development, it is increasingly evident that the incorporation of new materials into CMOS scaling has become a necessity. Our previous work in SiGe and III-V integration shows promise in allowing further materials integration for increased transistor density. However, a principal concern is that investment returns by further increasing transistor density will likely be negative for all but possibly one or two corporations – possibly for all. The innovation of incorporating III-V and other materials monolithically into silicon CMOS is now leading us into a pre-paradigm age in which metrics at the materials or device level are not sufficient to determine innovative value for CMOS+X combinations in the marketplace. Such an age is, by definition, a challenge for all organizations participating in the previous paradigm: research organizations, government funding agencies, and public and private corporations.
Despite these challenging times, we list the likely characteristics of a new innovation path, and describe our efforts to follow it through research into ‘white space’ integrated circuits employing new materials and devices. Initially, we are designing novel ICs, materials and processes incorporating GaN HEMTs, GaN LEDs, and InGaAs HEMTs monolithically into existing silicon CMOS foundry processes. Because of the CMOS+X, the opportunities for novel ICs is not just simply an integration of CMOS and X with reduced parasitics at the interface, but the opportunity for novel architectures. Novel ICs include a driver IC embodying CMOS for signal processing and GaN as the driver for the emerging electroluminescent panels; supply modulator for radio frequency amplifiers with substantially improved power efficiency; DC-DC converters with smaller form-factor yet improved power efficiency; photonic communications for multicore microprocessors with higher throughput yet lower power, etc. A modular process flow is incorporated so that the new devices can be modelled and incorporated into the design kit for a foundry process, allowing us to leverage much of the existing silicon design and manufacturing infrastructure.
Eugene A. Fitzgerald is the Merton C. Flemings SMA Professor of Materials Engineering at the Massachusetts Institute of Technology and Lead Principal Investigator of the Low Energy Electronic Systems (LEES) center of the Singapore-MIT Alliance for Research and Technology (SMART). His research interests are related to new materials, devices, and circuits. His work in lattice-mismatched materials resulted in the discovery of high mobility strained silicon. A practicing researcher, innovator, and entrepreneur, Prof. Fitzgerald is recipient of the IEEE 2011 Andrew S. Grove Award and the IEEE 2004 EDS George Smith Award. Professor Fitzgerald serves on the MIT President’s Committee for the Innovation Initiative, as well as the President’s Committee on the Future of MIT Education. He received a SB degree in Materials Science and Engineering in 1985 from MIT and his PhD in the same discipline from Cornell University in 1989.
Joseph Chang received his PhD (Otolaryngology), University of Melbourne. He is a professor and the director of Virtus (IC Design Center of Excellence) at the Nanyang Technological University, and was the former Associate Dean (Research). He is an adjunct professor at the Texas A&M University. His research is multi-disciplinary, including ECE, rad-hard, bioengineering, audiology/acoustics and printed electronics. He served as the Guest Editor in several IEEE publications including the Proceedings of the IEEE, IEEE JETCAS, etc., and as senior editor, editor and associate editor of numerous IEEE journals. He has also served as General Chair and keynote speaker of several major IEEE conferences/workshops, Chair of several IEEE Technical Committees and was an IEEE Distinguished Lecturer. He has >30 awarded and pending patents, founded two startups and has licensed technology to industry.